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The application of electronic devices in harsh environments, such as automotive environment, necessitates that packaging material meet stringent reliability requirements. Underfills not only need to redistribute thermomechanical stress across solder joints, but also should be sufficiently toughened in order to resist crack propagations due to mechanical vibrations and thermomechanical stress expected...
Due to the increased packaging density as well as the size reduction of the gap between the chip and the substrate in modern flip-chip technology, there is an increasing demand for the use of nanosized silica particles as fillers into underfill to further improve its comprehensive performance. However, silica nanoparticles (SNPs) cannot uniformly disperse into the polymer matrix and usually cause...
For electronic packaging applications, polymer based SiO2 composites with low CTE and low elastic modulus are of great importance to the thermal or mechanical stress relief and reliability improvement. However, it's still a great challenge to achieve these goals simultaneously by incorporating conventional SiO2 filler into resin matrix. In this study, we prepared the mesoporous SiO2 filler through...
We report a surface modification method to improve the filler-matrix interface in silica-epoxy composites. A double-layer modification scheme was used to coat silica with polysiloxane-based surface modifier molecules. The polysiloxane coating reaction was confirmed by SEM, DSC, and TGA analyses, and the coated silica exhibit good chemical compatibility with the epoxy matrix. The CTE of epoxy composite...
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