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We used a facile method to prepare PdCu hollow nanocubes (HNCs) and nanospheres (HNSs) for electroless copper or nickel deposition by via redox reaction with the sacrificial templates of Cu2O. The electrocatalytic performance of PdCu HNSs is higher than PdCu HNCs through CV and EQCM tests. Also, PdCu HNSs was applied to electroless copper and nickel deposition, and find that the quite low concentration...
The interfacial reactions in Cu/Sn-9Zn/Ni micro solder joints during reflow under temperature gradient was investigated in this study. And corresponding isothermal reflow of the micro solder joints as a reference experiment was also conducted. The results indicate that the Cu atoms can migrate to the opposite Ni side even against the temperature gradient while the Ni atoms can only migrate to the...
In this paper, we reported the performances of epoxy conductive adhesives filled with a low-melting-point Sn-Bi-Ag alloy. Results revealed the excellent stability, mechanical property of the Sn-Bi-Ag epoxy adhesives. Meanwhile, the thermal conductivity increased by increasing the content of Sn-Bi-Ag filler and 18 W m−1 K−1 can be obtained with 85% Sn-Bi-Ag filler content.
Electroplating is used here to fabricate a SnAgCu eutectic solders coating on copper substrate. The optimized coating is composed of Sn, Ag and Cu with the weight ratio of 96.4∶3.0∶0.6. Its melting temperature was confirmed at 215–220 °C. The coating thickness was controlled at 10 µm and its thermal conductivity reaches up to 56.7 W/mK.
The nonlinear I–V behavior of the three-phase SiC/CNTs/epoxy composites for high voltage field grading application was investigated, and a composite bulk hopping mechanism was proposed. It is hypothesized that nearest-neighbor electronic hopping occurs through thin epoxy layers between CNTs and SiC particles, and an asymmetric rectangular potential barrier structure is the mechanism governing the...
Heat generated by electronic devices and circuitry must be dissipated to improve their performance, reliability and prevent the premature failure. One of important methods is to fabricate composites with high thermal conductivity. In this study, we develop a novel approach for surface modification of boron nitride nanosheets and silicon nanowires by being decorated with silver nanoparticles. The resultant...
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