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Silicon carbide (SiC) is one of the most important third‐generation semiconductor materials. However, the chemical robustness of SiC makes it very difficult to process, and only very limited methods are available to fabricate nanostructures on SiC. In this work, a hybrid anodic and metal‐assisted chemical etching (MACE) method is proposed to fabricate SiC nanowires based on wet etching approaches...
Natural wood possesses a unique 3D microstructure containing hierarchical interconnected channels along its growth direction. This study reports a facile processing strategy to utilize such structure to fabricate carbon/silicone composite based flexible pressure sensors. The unique contribution of the multichannel structure on the sensor performance is analyzed by comparing the pressure response of...
Metal‐based materials with exceptional intrinsic conductivity own excellent electromagnetic interference (EMI) shielding performance. However, high density, corrosion susceptibility, and poor flexibility of the metal severely restrict their further applications in the areas of aircraft/aerospace, portable and wearable smart electronics. Herein, a lightweight, flexible, and anticorrosive silver nanowire...
Copper nanowires (CuNWs) are attracting a myriad of attention due to their preponderant electric conductivity, optoelectronic and mechanical properties, high electrocatalytic efficiency, and large abundance. Recently, great endeavors are undertaken to develop controllable and facile approaches to synthesize CuNWs with high dispersibility, oxidation resistance, and zero defects for future large‐scale...
Owing to the growing heat removal issue in modern electronic devices, electrically insulating polymer composites with high thermal conductivity have drawn much attention during the past decade. However, the conventional method to improve through‐plane thermal conductivity of these polymer composites usually yields an undesired value (below 3.0 Wm−1 K−1). Here, construction of a 3D phonon skeleton...
Recently, stretchable electronics have been highly desirable in the Internet of Things and electronic skins. Herein, an innovative and cost‐efficient strategy is demonstrated to fabricate highly sensitive, stretchable, and conductive strain‐sensing platforms inspired by the geometries of a spiders slit organ and a lobsters shell. The electrically conductive composites are fabricated via embedding...
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