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This paper presents a three-dimensional (3D) die-level integration platform, MorPACK. The structure of MorPACK is 3D stacked by the connection modules and circuit modules. It makes MorPACK platform own heterogeneous integration capabilities. With proper system partition and tri-state interface connection, the MorPACK system can be extended by the peripheral interfaces efficiently and alternate the...
This paper proposes a structure health monitoring device (HMD) with using three 1-axis accelerometers, microprocessor, analog to digital converter (ADC), and data logger for long span bridge. The proposed monitoring system achieves the features of low cost and data synchronization of three 1-axis accelerometers. Furthermore, we develop a packet acquisition program to receive the sensed data and then...
This paper proposes a heterogeneous system platform to speed up the implementation and verification of innovative design for integrating microphone array application. Comparing to state-of-the-art prototyping systems, the proposed platform named MorPACK (morphing package) achieves modularity and flexibility by adopting three concepts: substrate-level modularization, three-dimensional (3D) module stack,...
This paper presents a configurable CONCORD platform for Multi-Project System-on-a-Chip (MP-SoC) implementation. The multi-projects platform was created for integrating heterogeneous SoC projects into a single chip. The total silicon prototyping cost for these projects can be greatly reduced by sharing the common SoC platform. A configurable SoC prototyping platform CONCORD is created as a verification...
A silicon prototyping methodology is presented for Multi-Project System-on-a-Chip (MP-SoC) implementation. A multi-projects platform was created for integrating heterogeneous SoC projects into a single chip. The total silicon prototyping cost of these projects can be greatly reduced by sharing a common platform. To demonstrate the effectiveness of the proposed methodology, a MP-SoC chip was implemented...
The rise of WSN (wireless sensor network) and widely adopted WSN services on environmental monitoring make our lives safer. To bring higher level of intelligent services into lives, integration of various networking services in one area is a must. For example, in traditional security camera system, object stolen event is only handled as a post processing service. But, if we integrate WSN positioning...
This paper presents a Programmable SoC (Systemon-chip) design methodology which integrates multiple heterogeneous SoC design projects into a single chip such that the total silicon prototyping cost for these projects can be greatly reduced by sharing the common SoC platform. Results show that an integrated SoC platform is comprised of eight SoC projects. When these eight SoC projects are designed...
The SIP proxy server, which is an important building block of a SIP network, can be in a form of a cluster to prevent service unavailability caused by software or hardware failures. The design of a SIP proxy server cluster with a single dispatcher in a SIP network faces the single-point-offailure problem. The use of dual SIP dispatcher architecture was proposed and VRRP (Virtual Router Redundancy...
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