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In this study a relationship between the chemical and mechanical degree of cure (i.e. α and β, respectively) is investigated for a standard phenol–formaldehyde resin (PF). Dynamic mechanical analysis (DMA) is conducted on PF-bonded wood joints under various isothermal and linear heating regimes. Model free kinetics (MFK), viz Friedman, Vyazovkin and Kissinger–Akhira–Sunnose algorithms, are assessed...
Cure development of phenol–formaldehyde (PF) resins has been extensively modeled based on chemical advancement. However, it is in situ mechanical development of wood–adhesive systems that is most relevant with process optimization such as hot-pressing of wood-based panels. The objective of this research is to examine the feasibility of applying common model-fitting kinetic analyses to describe cure...
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