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A semianalytical model of the through-silicon via (TSV) capacitance for elevated operating temperatures is derived and verified with electrical measurements. The effect of temperature on the increase in TSV capacitance over different technology parameters is explored, and it is shown that higher oxide thickness reduces the impact of temperature rise on TSV capacitance, while with low doped substrates,...
In this paper we demonstrate functional 3D circuits obtained by a 3D Stacked IC approach using both Cu Through Silicon Vias (TSV) First and cost effective solution Die-to-Wafer Hybrid Collective bonding. The Cu TSV-First process is inserted between contact and M1. The top die is thinned down to 25 ??m and bonded to the landing wafer by Hybrid Bonding. Measurements and simulations of the power delay...
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