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Open Source Software (OSS) development is distributed across actors and artifacts and involves translating diffuse representations into distinct sets of contiguous code artifacts. Despite the highly distributed and dynamic nature of OSS development, it is often described in unitary, monolithic terms - an unfortunate situation which masks considerable variance across OSS development processes. Therefore...
Round-robin measurements on the linewidth enhancement factor are carried out in many laboratories participating to EU COST 288 Action. Up to 7 different techniques are applied to DFB, VCSELs, QCL, and QD lasers, and results are compared.
Round-robin measurements on the linewidth enhancement factor are carried out within several laboratories participating to EU COST 288 action. The alpha-factor is measured by applying up to 7 different techniques. The obtained results are compared.
The silicide growth over the spacers (bridging) in the conventional self-aligned silicide process using titanium disilicide is dominated by the lateral diffusion of Si atoms from the gate and source/drain areas. A TiN cap layer, which has been suggested to minimize the bridging problem was studied. The influence of such a capping layer on the reaction between Ti and Si, on the lateral diffusion of...
The use of sputter deposited TiW (15/85 w.t.%) as a direct contact material to p+ silicon is evaluated. The effect on the contact resistance of different post-implant activation conditions, e.g. rapid thermal processing and conventional furnace annealing in dry or wet ambients, has been studied. For comparison parallell measurements were done on identically processed wafers metallized with aluminium...
Sputtered TiW(15/85 wt.%) has been investigated as a diffusion barrier layer between Al and Si and as a direct contact material to n+-and p+-doped silicon areas. Rutherford backscattering spectroscopy (RBS) in combination with reverse leakage current measurements on gated diodes were used to investigate the barrier properties of the deposited TiW films. TiW was observed to prevent intermixing between...
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