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We presented a 32-channel silicon hybrid demultiplexer fabricated with CMOS technology. Double-etched mode converter and wide arrayed waveguide are used to improve AWG performances while the counter-tapered coupler is optimized for broadband mode multiplexing.
A novel fiber-to-chip edge coupler with two tapered tips and a multimode interference combiner is demonstrated on a silicon-on-insulator platform. It has advantages over a single-tip edge coupler on coupling loss, bandwidth and misalignment tolerance.
We presented a comparison and analysis on single-layer silicon fiber-to-chip edge couplers with different taper tips. The double-tip edge coupler exhibits a lower coupling loss, larger bandwidth and better fabrication tolerance. In addition, the short edge couplers with 40 μm length have the best performances.
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