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Void growth and coalescence usually cause reliability concerns to solder joints in integrated circuits. In this paper, a diffuse interface model is developed to simulate the coalescence of micro-voids under the influence of elastic stresses and electromigration. A variable c stands for the composition of vacancies, with c=1.0 indicating the void phase and c=1.0×104 indicating the bulk phase. A double...
Void growth and coalescence usually cause reliability concerns to solder joints in integrated circuits. In this paper, a diffuse interface model is developed to simulate the coalescence of micro-voids under the influence of elastic stresses and electromigration. A variable c stands for the composition of vacancies, with c=1.0 indicating the void phase and c=1.0×104 indicating the bulk phase. A double...
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