The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Besides the usually known TSV technologies to etch and fill Si interconnects there is a powerful photo-assisted electrochemical etch technology for fine pitch TSV, which goes hand in hand with a liquid fill metallization. Both together allow the generation of high density wiring on and through thick self-carrying interposers, where other technologies fail. Together with any etching technology the...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.