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In this paper, finite-element models were developed to calculate the elastic fields within both solder and Cu-pillar bumps under the influences of thermal stresses and Joule heating. First, a steady-state equation of the electric potential is solved to determine the electric field and thus, the effect of Joule heating. Then, the temperature field is obtained by solving a steady-state equation of thermal...
This paper studies the influence of partial discharge (PD) on crack propagation in piezoelectric materials under combined mechanical and electric loads. According to Stroh formalism, the electric field is obtained based on the semi-permeable electrical boundary condition inside the crack. Then, the crack propagation effects of the electric field without PD are discussed through considering the contribution...
This paper studies the electric breakdown problem of a semi-permeable crack in piezoelectric material under combined mechanical and electric loads. According to Stroh formalism, the differences of the electric potential and the displacement of the crack are first derived and the quadratic equation containing the electric displacement inside the crack is obtained. Meanwhile, the electric field is also...
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