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Three-dimensional integrated circuit as an extension of the conventional two dimensional processes is viewed as the best choice to continue Moore's law. The extreme miniaturization of size and the complication combination of structure of 3-D integrated circuit make a higher request to the relevant technologies including wafer thinning. Be living in the process of finding the new principle of wafer...
The paper investigates the insertion force and contact reliability of N electric connector. A finite element model (FEM) of the contacts was created and simulation of the contact force was completed by ANSYS. Impact of the friction coefficient, shrink range, length of socket, and groove width on the insertion force was analyzed by changing the structural parameters. Variation curves of the insertion...
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