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In present paper, Hg(II) modified graphene oxide (Hg(II)/GO) was firstly prepared by reaction of graphene oxide (GO) with Hg(II). The Hg(II)/GO dispersed in a Nafion solution was coated on the polished glassy carbon electrode (GCE) for fabricating the enhanced electrochemical sensing platform. And then Hg(II)/GO modified GCE was held at a negative potential (−1.0V) to reduce the coordinated Hg(II)...
SOP (Small Out-line Package) has a very broad application in semiconductor for a long time. HSOP is the SOP package with heat sink on lead frame. This paper is focusing on HSOP package assembly development.
CMOS 90 wafers had been applied to BGA (Ball Grid Array) packages for many years. However, the application to lead package is not much. This paper introduced one application for CMOS 90 wafers to LQFP (Low profile Quad Flat Package). Simultaneously, it is for automotive application and need meet AEC Grade 1 reliability requirements [1]. Low alpha green compound is required for this package to reduce...
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