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A polymer blend consisting of poly(2‐allyl‐6‐methylphenol‐co‐2,6‐dimethylphenol) (APPE) and polystyrene (PS) with additives such as 1,2‐bis(4‐vinylphenyl)ethane, cyanate ester, and nitrile butadiene rubber was formulated as an insulating high‐frequency adhesive film. The polymer blend of APPE and PS showed very high compatibility to these additives, and the resulting thermally cured polymer blend...
New aromatic polyimides (PIs) having the lowest dielectric constant in nonfluorinated PIs have been developed from aromatic dianhydrides and an aromatic diamine containing phenylene ether units. The diamine monomer was prepared from 4-bromophenyl ether in five steps. Polycondensations were performed in 1-methyl-2-pyrrolidinone at room temperature for 18h, giving poly(amic acid)s (PAAs) with inherent...
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