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Docking an autonomous underwater vehicle is a critical part of many current and envisioned Navy, commercial, and scientific missions. In the Defense Advanced Research Projects Agency's (DARPA) Tactical Undersea Network Architectures (TUNA) program, docking a vehicle is a key enabler for several of the proposed concepts of operation. To support the program, a series of risk reduction tests were performed...
Docking an autonomous underwater vehicle (AUV) is a critical part of many current and envisioned Navy, commercial, and scientific missions. Many missions require an AUV to dock with a subsea node that is not restrained through attachment to the seafloor or to a surface platform significantly larger than the system that is docking into it. Space and Naval Warfare Systems Center Pacific (SSC Pacific)...
Intensive FEA modeling was applied to the investigation of early solder joint failures of WLCSP mounted on test PCBs. In particular, stress in assembly reflow process was studied with 25 balls; 0.4 mm pitch WLCSP and PCBs with specially placed plated though vias. The 25 ball WLCSP in the study has 5×5 ball array, which corresponds to 16 outmost solder joints and nine inner solder joints, all soldered...
A power system in package (SiP), which has high-side (HS) and low-side (LS) MOSFETs, and a driver IC, is investigated in this paper. To reduce cost and improve time to market, electrical, thermal and mechanical virtual prototyping are applied to investigate the electrical, thermal and reliability performance of the power SiP. Totally 8 DoE legs are designed to study the impact of bond wire diameter,...
In this paper, a comprehensive modeling and test study is presented for the dynamic behaviors of WL-CSP subjected to JEDEC drop impact. A direct non-linear transient implicit dynamic method is introduced with the non-linear dynamic material properties that include solder, the aluminum metal stacking under the UBM and the PCB copper pad. The packages mounted on PCB and under PCB are checked and discussed...
In this paper, a numerical simulation-based parametric study on wire bonding is implemented by the probability method that combines the response surface strategy and the Monte Carlo random simulation method. The distribution probabilities of the peak stress values in metal and interlayer dielectric (ILD) stack layers are discussed with the variation of free air ball radius, Al pad thickness and ball...
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