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The sealing and contact bonding of IMU (inertial measurement unit) are important procedures in the MEMS device fabrication. Conventional process is Al-Ge eutectic bonding developed by InvenSense, for which the process temperature is above 450°C and the bonding time is longer than 1 hr. This study proposes an innovative and efficient process combined with an air plasma bombardment and a following catalyzed...
This paper demonstrated the application of Surface Enhanced Raman Scattering (SERS) technology on quantitative analysis in hemodialysis system for real time inspection. SERS has already been proved in high accuracy due to the Raman optical fingerprint signal is unique for every different compound. We investigate the use of silver film on nanosphere (AgFON) SERS technology can distinguish the small...
In recent years, through wafer electrical connections have become important roles, which will be used in developing high-speed, compact 3D microelectronic devices in next generation. Although the electroplating copper is a well-established process, completely void-free electroplating in through silicon holes (TSH) with a high aspect ratio remains a big challenge. Naturally, local current distribution...
Through-silicon-via (TSV) technology has been employed for three-dimensional (3D) packaging of multi-chips. A high interwafer interconnect density can be achieved with a minor area penalty. Having shorter signal paths between dies make it possible to improve the system's performance by permitting the system to run faster, alleviate interconnect delay problems, it also consumes less power. Copper has...
In order to realization electronic parts product appearance quality detection control, one kind of processor based on the intelligent knowledge automatic extraction and system intelligence modeling was presented. In the processor, wavelet-fuzzy technique and neural network technique are combined. Uses the fuzzy wavelet extraction image feature, and wavelet function is used as fuzzy membership function...
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