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For advanced technology, the current industry is seeing very complicated silicon defect types and defect distribution. It is very common for the yield of a new design to start at a very low level and it's critical to ramp up yield as quickly as possible to meet the market window. During manufacturing stage for volume production, yield excursions do occur and the yield needs to be improved to a stabilized...
Advanced bright field (BF) inspector have many functions to increase the defect signal, and suppress the background noise. However, it will take much time to fine tune an optimized BF inspection recipe. The aim of this paper is to propose a faster way to select the optimized optics.
Advanced high performance dark field (DF) inspection is usually utilized at larger defects and the excursions in etch, chemical mechanical polish (CMP) or film deposition processes inspection at high production throughputs. Here demonstrates risky scratch defects right after post poly-silicon CMP captured by DF inspection technique.
Various three-dimensional (3D) multilayer stacks NAND flash architectures are developed by several companies, the defect performance monitoring under such complicated architectures has become a new challenge in 3D NAND flash. The aim of this paper is to illustrate e beam inspection system can monitor the tiny, invisible defects and electrical defects that can not be recognized by optical systems.
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