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The paraventricular nucleus (PVN) of the hypothalamus harbors diverse neurosecretory cells with critical physiological roles for the homeostasis. Decades of research in rodents have provided a large amount of information on the anatomy, development, and function of this important hypothalamic nucleus. However, since the hypothalamus lies deep within the brain in mammals and is difficult to access,...
Fan-out wafer level package (FOWLP) technology becomes more attractive because of its flexibility for integration of diverse devices in a very small form factor. As FOWLP is composed of various materials, the proper structural and material selection designs are important to meet reliability requirements. In this study, thermal properties of FOWLP with different package structures were evaluated to...
In new applications (such as MEMS, bio-MEMS), vertical integration requires a low processing temperature below 200°C to bond these devices without degrading their performance. Low temperature bonds are thin intermetallic compounds (IMCs) bonds that are formed between devices when plated layers of different metals on each side of the component come into contact under relatively low temperature and...
Low temperature bonds are thin intermetallic bonds that are formed between devices when plated layers of different metals on each side of the component come into contact under relatively low temperature and high pressure. These joints comprised completely of intermetallic compounds, will fail in a sudden unexpected manner, compared to normal solder joints which fail in a ductile manner where cracks...
We report for the first time that extreme EOT scaling and low n/p VTHs can be achieved simultaneously. Underlying mechanisms that enable EOT scaling and EWF tuning are explained and the fundamental device parameters including reliability of the extremely scaled devices are discussed. Record low gate leakage, appropriately low VTHs and competitive carrier mobilities in this work demonstrate the gate...
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