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A novel low-temperature, pressureless bonding approach by electroless plating with controlled flow through a microfluidic device, in which a laminar forced convection flow of electroless solution was passing through a microchannel between dies and to gaps between copper pillars, was developed to metallically interconnect copper pillars together. Previous study had been demonstrated that, with the...
High bonding temperature and force are known to cause physical damage to the device. The objective of this present study is to develop a new low-temperature and pressureless bonding method for Cu-to-Cu interconnects using electroless Ni plating. Two plating methods were employed to test the feasibility of electroless bonding of copper pillars. The first method was carried out in a stirred plating...
In the face of too lower recycling rate of end-of-life vehicles (ELV) in China, we establish an optimized recycling price model to enhance recycling rate through constrained nonlinear programming. The solution of this model is obtained using Lagrangian relaxation algorithm. The performance of the proposed solution method has been demonstrated with computational experimentation. Furthermore, this paper...
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