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In this paper, eye-diagrams of coupled microstrip channel on Printed Circuit Board (PCB) are estimated using equivalent circuit model. The equivalent circuit model has RLGC terms which are calculated from the physical dimensions of the coupled microstrip channel. Since the coupled microstrip channel is modeled by physical dimensions, eye-diagrams are estimated without 3D Full EM simulation, which...
Noise coupling through the substrate or silicon interposer among adjacent TSVs has a significant impact on the signal integrity of the TSVs. Since resistance and capacitance are dependent on temperature, more accurate electrical models for TSVs should incorporate the temperature dependency of the material. This paper presents high-frequency temperature-dependent RLGC models for two neighboring TSVs...
Through silicon via (TSV) has been extensively highlighted as the key solution for small form factor wide bandwidth, and low power consumption with compactly integrating multiple chips. Despite the many advantages of TSV based 3-dimensional integrated circuit (3D IC), there are several challenges to be overcome such as noise coupling, fabrication process limits, and failure issues. In this paper,...
Through silicon via (TSV) based 3-dimensional integrated circuit (3D IC) has become the key solution to satisfy continuously increasing demands for small form factor, wide bandwidth, high performance, and low power consumption on electronic devices. However, there still remain several challenges to be solved; one of the most significant issues in 3D IC is TSV to active circuit noise coupling. In this...
To overcome power distribution network (PDN) design challenges such as serious power noise, large system area burden, the wireless power transfer (WPT) system in the 3D package and IC is applied. In this study, the 3D multi-helix inductor is proposed for designing the 3D package and IC with a WPT scheme and an equivalent circuit modeling is also implemented. The fabricated package WPT system represents...
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