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Effect of passivation opening on electromigration in eutectic SnPb solder joints is investigated in this study. Solder bumps were fabricated with a polyimide (PI) and without a PI layer. Both sets of solder joints were subjected to electromigration tests by 0.8A at 150??C. Kelvin probes were employed to monitor the increase in bump resistance during electromigration. The bump failure is defined when...
Summary form only given. The conventional wire bonding has employed gold and aluminum wires as interconnection material for decades. With the requirements for high speed, high power and fine pitch applications, copper is emerging as the alternative bonding wires to replace gold and aluminum. In principle, copper has relatively good electrical mechanical and thermal properties. However, copper is known...
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