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A fluxless bonding technique using Sn-Cu multilayer composites to produce high temperature joints at relatively low temperature is presented. At a 280°C process temperature, joints which were almost void-free, with a melting point of 415°C, were made. With a further annealing step, re-melting temperature of the joints increases to 713°C. The technique, thus, gives a quantum jump to the post-processing...
A 200°C fluxless process is developed to produce In-Cu joints. The fluxless feature is achieved by preventing indium oxidation during composite fabrication and the subsequent bonding process. Indium and copper are deposited on an object in high vacuum to inhibit indium oxidation. Copper interacts with indium to form a CuIn intermetallic that further protects the inner indium from oxidation. For the...
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