Search results for: H. Jung
IEEE Transactions on Electromagnetic Compatibility > 2017 > 59 > 5 > 1558 - 1564
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 1 > 138 - 152
2015 International 3D Systems Integration Conference (3DIC) > TS8.29.1 - TS8.29.4