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In this paper, silicon/glass/organic interposers for 2.5D/3D interconnects are investigated for signal integrity analysis. As total system bandwidth increases, memory industry has been developed to satisfy its requirements. Therefore, High Bandwidth Memory (HBM) is introduced to the market. HBM enables TeraByte/s bandwidth with extremely fine pitch, short interconnects using Through Silicon Via (TSV)...
Through silicon via (TSV) has been extensively highlighted as the key solution for small form factor wide bandwidth, and low power consumption with compactly integrating multiple chips. Despite the many advantages of TSV based 3-dimensional integrated circuit (3D IC), there are several challenges to be overcome such as noise coupling, fabrication process limits, and failure issues. In this paper,...
Through silicon via (TSV) based 3D-IC is the key technology to satisfy the continuously growing demand on lower power consumption, higher system bandwidth and smaller form factor of electronic devices. As the I/O count increases up to the order of tens of thousands for high speed data transmission, TSV diameter and interconnection pitch are reduced, which may cause various defects throughout the channel...
In this paper, crosstalk included eye diagram of high-speed and wide I/O interposer channels are simulated and analyzed. To analyze the crosstalk effect of various substrate channels, silicon, glass, and organic interposers are simulated and compared under the same physical dimensions. In addition, crosstalk included eye diagrams are accurately estimated in short time using 8 worst case input signals...
In this paper, we propose the structure of bump-less high speed channel on interposer in through-via based 2.5D or 3D integrated circuit (IC). Electrical characterization of the proposed structure is analyzed by simulation in the frequency-and time-domain. In order to discuss and analyze the electrical characteristics of the proposed structure in detail, the bump-less channel and the channel with...
Hermetic encapsulation of long-term implantable devices using ceramics has been investigated over several decades. Our studies focus on the miniaturization of ceramic encapsulations for large numbers of stimulation channels. Laser-patterning of screen printed platinum (Pt) paste on cofired ceramics has been shown to enable the construction of features comparable in size to classical screen printing...
Today the European GaN interest is slightly shifting away from academic research to development and industrialization of technology, devices and applications. The recent public funding was started to accelerate the transition from academica to industry on all levels like EC, national and by Space Agencies. In the paper the today's running projects and the upcoming trends will be described.
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