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Plasma cleaning process which can remove surface contamination from the electrode films on the circuit board becomes more and more important in the microwave module production, since it offers high bondability and reliability of wire bonding. The principle theory of plasma cleaning process was discussed in the paper, the optimal process parameters of plasma claening process were used to improve the...
Plasma cleaning process which can remove surface contamination from the electrode films on the circuit board becomes more and more important in the microwave module production, since it offers high bondability and reliability of wire bonding. The principle theory of plasma cleaning process was discussed in the paper, the optimal process parameters of plasma claening process were used to improve the...
Au wire bonding technology used in microwave modules was studied in wedge bonding way in this paper, the optimal process parameters of wire bonding technology were obtained by using Taguchi method to improve the wire bonding reliability. The results indicate that the factors influencing wire bonding are US power, bonding force and bonding time in turn, and the optimal process parameters are US power...
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