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The solder ball pitch of BGA packages in mass production now is normally above 0.5 mm. To fulfill the future demand of package miniaturization, the 0.4 mm ultra fine pitch BGA solder joint was researched in this paper. The solder volume shrinkage along with the ball pitch decrease was found to affect the joint microstructure, which could be characterized in two aspects: the Sn dendrites in bulk solder...
In this paper, the behavior of BGA solder joints microstructures was studied as a function of Ni doping in SAC solder. Three kinds of solder compositions were selected including Sn3.0Ag0.5Cu, Sn1.0Ag0.5Cu and Sn1.0Ag0.5Cu0.02Ni to value the influence the effect of Ni doping, OSP and Au/Ni pad was employed on the PCB side. Emphasis was placed on studying the effect of low level doping with Ni on the...
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