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The microstructure, the wettability and dissolution behavior of Sn0.8Ag0.5Cu2.0Bi0.05Ni (SACBN) and Sn3.0Ag0.5Cu (SAC305) lead-free solder alloys were comparatively investigated. The results show that the microstructure of SACBN solder alloy contains β-Sn and eutectic phase, and that the eutectic phase is made of β-Sn, well-ditributed needlelike Ag3Sn, granular (Cu, Ni)6Sn5 and minor granular Bi....
Mg1-xFexB2 superconductor was prepared by in situ solid state reaction to study the effects of nano-iron doping on the superconductivity of MgB2. Two kinds of nano-iron sources were used: nano-iron particles and nano-iron wires. It was found that crystal structure was not affected by nano-iron doping for either form of dopant source. Tc, Jc, and Hirr were severely suppressed by iron nano-particles...
The solder ball pitch of BGA packages in mass production now is normally above 0.5 mm. To fulfill the future demand of package miniaturization, the 0.4 mm ultra fine pitch BGA solder joint was researched in this paper. The solder volume shrinkage along with the ball pitch decrease was found to affect the joint microstructure, which could be characterized in two aspects: the Sn dendrites in bulk solder...
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