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The effects of cooling rate on the microstructure and microhardness of Sn-3.0Ag-0.5Cu solder was studied. The results showed that the undercooling of the solder increases with the cooling rate increasing, resulting in eutectic composition shifting to the hypoeutectic region, thus increasing the volume ratio of the primary β-Sn and decreasing its grain size, Simultaneously, Ag3Sn in the eutectic region...
The microstructure, the wettability and dissolution behavior of Sn0.8Ag0.5Cu2.0Bi0.05Ni (SACBN) and Sn3.0Ag0.5Cu (SAC305) lead-free solder alloys were comparatively investigated. The results show that the microstructure of SACBN solder alloy contains β-Sn and eutectic phase, and that the eutectic phase is made of β-Sn, well-ditributed needlelike Ag3Sn, granular (Cu, Ni)6Sn5 and minor granular Bi....
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