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A novel 1-level interconnection/transition method for radio frequency micro-electronic-mechanic system (RF MEMS) devices is proposed in this paper. Using bumping-bridge structure which is composed of a chip substrate, a coplanar waveguide (CPW) transmission line fabricated on the substrate and a group of metal bumps set on the ends of the CPW line, this method combines the advantages of both flip-chip...
A novel 1-level interconnection/transition method for radio frequency micro-electronic-mechanic system (RF MEMS) devices is proposed in this paper. Using bumping-bridge structure which is composed of a chip substrate, a coplanar waveguide (CPW) transmission line fabricated on the substrate and a group of metal bumps set on the ends of the CPW line, this method combines the advantages of both flip-chip...
This paper presents the studies on the influences of thermally induced package effects on radio frequency (RF) characteristics of surface acoustic wave (SAW) devices. A packaged SAW resonator is modeled based on finite element method (FEM), and surface deformation of the chip substrate during packaging process is analyzed. RF characteristics of the device are simulated and compared before and after...
This paper presents an equivalent-circuit method for analyzing the coupled field behavior of packaged distributed radio frequency microelectromechanical system (RF MEMS) devices. A distributed RF MEMS phase shifter is taken as an analytic example. The whole structure of the packaged device is divided into fundamental elements. The thermo-mechanical, electrostatic and electromagnetic models for different...
This paper presents a modeling of the mechanical-thermo-electromagnetic coupling behavior of packaged distributed radio frequency microelectromechanical systems (RF MEMS). The whole structure is divided into fundamental elements. These elements are connected via both lumped nodes and distributed nodes. The thermo-mechanical and/or the electromagnetic models for each element are analytically established...
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