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Air gaps introduced at the trench level of advanced interconnects provide a means of lowering effective dielectric constant, k eff , without the use of mechanically weak ultra low-k films. Filament-assisted chemical vapor deposition (FACVD) is a promising technology for depositing polymers, dielectrics and metals. Initiated chemical vapor deposition (iCVD) is a novel one-step method of depositing...
A filament-assisted chemical vapor deposition (FACVD) concept for back-end-of-line (BEOL) applications is presented. Key capabilities of this technology include low-temperature plasma-free film deposition with straightforward scalability and extendibility. Deposition mechanism and film properties are compared with conventional plasma-enhanced CVD (PECVD). FACVD deposition of a decomposable polymer...
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