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The characterization of interconnection lines used in the design of high frequency synchronization systems is presented in this paper. The transmission line characterization is carried out from the corresponding S-parameter measurements of two microstrip line test structures designed and fabricated using an Austriamicrosystems 0.35 ??m process technology. The microstrip test structures are fabricated...
In this work, a systematic analysis of the transmission line models used for high-frequency global interconnection lines is presented. As part of this analysis, two model implementations are carried out using: i) the technology parameters provided by the manufacturer, and ii) the scattering (Sij) parameters associated with a transmission line. In order to serve as test vehicles, a chain of inverters...
The ground vias are used to interconnect the different ground planes existing in a package structure, but also to prevent the propagation of parasitic modes like the parallel-plate mode inside the structure. From a signal integrity perspective, these parasitic modes degrade and limit the performance of a package since they introduce undesired resonances in the electrical response of the structure...
An analytical methodology for characterizing electrical transitions associated with transmission line-based microwave channels is presented in this paper. The methodology is formulated using ABCD matrixes obtained from S-parameters measured to two lines with different length and terminated with the transition under investigation. This allows to determine the two-port network parameters of the transition...
In this paper, we demonstrate the feasibility to characterize and model singled-ended electronic packages using experimental S-parameters up to 30 GHz. TRL calibration and transmission line theory techniques were applied to obtain the two-port network parameters of the packages from measurements performed to package-to-transmission line test structures. With this information, an assessment of the...
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