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We introduce the possibility of improving a single-cell capacitive micromachined ultrasonic transducer (CMUT) for air-coupled ultrasound by simply adding a hollow conical-shaped structure (horn) on top of the CMUT plate. The main objective is to improve both transmit and receive sensitivity by lowering the center-to-average displacement ratio, which for bending plate operated devices inherently is...
We report on a capacitive resonant sensor with an oxide-nitride (ON) layer used as charge trap. The main idea is that we intentionally inject charges into the ON layer by biasing the device for 30 s with 160% of the pull-in voltage. We use a capacitive micromachined ultrasonic transducer (CMUT) to demonstrate this idea. The CMUT is fabricated via high temperature assisted direct wafer bonding after...
We present the successful fabrication of capacitive micromachined ultrasonic transducers (CMUTs) based on low temperature wafer bonding (< 400°C). Such a fabrication process enables the direct integration of CMUTs on top of IC substrates, and requires only two additional lithography steps for fabricating the complete CMUT. Our approach benefits from both the integrated electronics and the well-controlled...
We introduce a versatile fabrication process for direct wafer-bonded CMUTs. The objective is a flexible fabrication platform for single element transducers, 1D and 2D arrays, and reconfigurable arrays. The main process features are: A low number of litho masks (five for a fully populated 2D array); a simple fabrication sequence on standard MEMS tools without complicated wafer handling (carrier wafers);...
The successful packaging and electronics integration of large 2D array devices with small pitch-sizes, such as fully populated 2D ultrasonic transducer arrays, require a flexible, simple, and reliable integration approach. One example for such electronics integration is based on through silicon vias (TSVs) with under-bump metallization (UBM) stack for solder bumping. In this paper, we demonstrate...
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