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We discuss high density optical interconnects integrating an arrayed laser diode, silicon optical modulators, and germanium photodetectors on a single silicon substrate. A 5-Gbps error free data transmission with a 3.5-Tbps/cm2 transmission density was demonstrated. Moreover, recent advances in silicon-InAs/GaAs hybrid quantum dot lasers by using a direct wafer bonding technique is discussed. We achieved...
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