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Zn5Al−xSiC composite solder was used to join Al2O3 ceramic and 2024Al with ultrasonic‐assisted soldering process. Before the soldering of Al2O3 ceramic and 2024Al, the Al2O3 ceramics were wetted by molten Zn5Al solder under the action of ultrasonic. In the process of ultrasonic wetting, Al element in Zn5Al solder and O element are formed Al2O3 on the Al2O3 ceramic surface. SiC particles are mixed...
Herein, the blade‐coated conductive ink on poly(ethylene terephthalate) substrate with unique features is demonstrated, aiming at the fabrication of flexible light‐emitting electronic devices. The inks are prepared by combining carbon‐based fillers and epoxy resin to achieve a high‐performance 3D conductive channel network with low resistance. The carbon‐based channels in the conductive composites...