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The electromigration in SnAg solder bumps with and without Cu column UBM have been investigated at 2.16×104 A/cm2 at 150°C. Different failure modes were observed for the two types of samples. When the SnAg solder bump with only Ni UBM was stressed by 2.16×104 A/cm2, open failure occurred in the bump that the direction of electron flow was from the chip side to the board side. However, the crack formed...
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