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This paper demonstrates two major works, experimentally determines the material properties and accurately predicts the dynamic response of stressed region on the bond pad and beneath the contact area. The characteristic of heat affected zone (HAZ) on both Au wire and Cu wire have been carefully experimental evaluated. In addition, the dynamic response on Al-Cu pad and beneath the pad of Cu/low-k wafer...
In the present paper, the characteristic of heat affected zone (HAZ) on both Au wire and Cu wire have been carefully experimental evaluated. In addition, the dynamic response on Al-Cu pad and beneath the pad of Cu/low-k wafer during wire bonding process has been predicted by using finite element method. Material property for Cu wire from mechanical tensile test has shown much more rigid than Au wire...
In the present paper, the tensile mechanical properties of thin gold wire before/after electric flame-off (EFO) process have been investigated by self-design pull test fixture. Microstructure characteristics of free air ball (FAB) and heat affected zone (HAZ) are also carefully investigated. The accurate experimental material data should be reflected as input for precise finite element analysis. Numerical...
In the present paper, the tensile mechanical properties of thin gold wire before/after electric flame-off process have been investigated by self-design pull test fixture. Microstructure characteristics of free air ball (FAB) and heat affected zone (HAZ) are also studied. The accurate experimental material data should be reflected as input for precise finite element analysis. Numerical model based...
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