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An octant 3D finite element (FE) model of plastic ball grid array (PBGA) assembly system was developed according to actual package product. The FE method was used to study the creep strain and reliabilities of solder joints under four thermal cycles. The distribution of the creep strain of solder joints under temperature loading was analyzed, and the reason of which was investigated. 95.5Sn-3.8Ag-0...
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