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Hydrostatic stress of Cu damascene interconnects was calculated by using finite element method in the present work. The analytical work was performed to examine the distribution of hydrostatic stress and the effect of different line width in the Cu interconnects. Then a model of atomic diffusion was presented and used to calculate the size of stress-induced voiding according to result of hydrostatic...
Hydrostatic stress of Cu damascene interconnects were calculated by using commercial finite element software in the present work. The analytical work was performed to examine the distribution of hydrostatic stress and the effect of different low-k dielectrics and barrier materials in the Cu interconnects. The results indicate that the hydrostatic stress is strongly dependent upon different low-k dielectrics...
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