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Development of fifth‐generation technology leads to a growing demand for materials with exceptional thermal property, mechanical strength, and low dielectric loss. However, ensuring the broad application of such materials by comprehensively investigating their aging mechanisms and service lifetimes remains a challenge. In this work, we have developed a glass fiber (GF) reinforced liquid crystal polymer...
Aimed at the status of low anti-bending property and relatively high failure rates of the multilayer ceramic capacitors which are widely used in the electronics industry. The board level interconnect with the typical multilayer ceramic capacitor were designed and fabricated. The effects of the monotonic bending loading on the multilayer ceramic capacitor board level interconnect were analyzed, including...
In order to reduce the mechanical stress damage caused by the electronic assembly processing, it is necessary to recognize stress risk and formulate effective technique to manage it. By using resistor straining testing technique, the distribution map of strain of PCB were obtained during the typical electronic assembly processes including depanelling and fastening screws, which clearly demonstrate...
LED luminaire system has lots of failure modes. And the interaction among various failure mechanisms is extremely complex. There is a great obstacle existed in assessing the system reliability of LED luminaires. Therefore, in order to quickly and accurately assess the reliability of LED luminaires products, a test procedure for indoor lighting LED luminaires is initially proposed in this study. Firstly,...
Under the global trend of energy and emission reduction, light emitting diode (LED) has attracted more and more people's attention due to its distinctive advantages of long lifetime, high reliability, low energy consumption, green environmental protection. However, in order to evaluate the reliability of LED luminaires, few or no failure time data could be obtained with the traditional accelerated...
Two enhanced high power LED thermal structures with LTCC (Low Temperature Cofired Ceramics) packaging are presented. At first, these two types of structures are introduced respectively in details. One is called structure GPC (Gold-plated Copper) and the other is called structure SPA (Silver-plated Aluminum). Later, thermal analyses are made by CFD software and the calculated-junction-temperature will...
In this paper, some models of LED luminaires with drive power supply were established by Pro/Engineer. The temperature distribution of these models was obtained by ANSYS Workbench. And the influences of the location of drive power supply and surface areas of heat sinks were discussed. When drive power supply was located in different groove, the temperature of drive power supply was gradually reduced...
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