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We investigated the evaporative cooling performance of a nanoporous membrane based thermal management solution designed for ultra-high heat flux dissipation from high performance integrated circuits. The biporous evaporation device utilizes thermally-connected, mechanically-supported, high capillarity membranes that maximize thin film evaporation and high permeability liquid supply channels that minimize...
The generation of concentrated heat loads in advanced microprocessors, GaN electronics, and solar cells present significant thermal management challenges in defense, space and commercial applications. Liquid to vapor phase-change strategies are promising due to the high latent heat of vaporization of the working fluid. In particular, thin-film evaporation has received increased interest owing to advances...
Capillary-driven thin film evaporation in wick structures is promising for thermal management of high-power electronics because it harnesses the latent heat of evaporation without the use of an external pumping power. The complexities associated with liquid-vapor interface and liquid flow through the wick structures, however, make it challenging to optimize the wick structure geometries to boost the...
The emerging three-dimensional vertical chip stacking architecture is expected to reduce form factor and improve performance by providing energy efficient chip design. However, increased power density and non-uniform heat generation in stacked dies offset its advantages and pose a significant thermal management challenge by creating hotspots where heat loads in excess of 1 kW/cm2 are generated from...
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