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Micro-channel cooler is a very promising approach to meet the requirements of microelectronics package cooling. A lot of investigations about micro-channels have been undertaken in the past years. A silicon micro-channel can remove 790 W/cm2 heat with a temperature rise of 71 degrees between the substrate and the coolant. The width and height of the silicon channel are 50 mum and 302 mum separately...
Since the pioneering work by Tuckerman & Pease, lots of publications about heat sink have been researched in the last decade. Many enhancements are suggested in order to increase the critical heat current of heat sink including nanofluids which are solid-liquid mixtures composed of nanoparticles and basic liquid. The values of the thermal properties of nanofluids are enhanced to a large degree,...
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