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Current densities of 1.5ASD and additive concentrations of 15ml/L were used to electroplate the copper into TSV to fabricate the test samples. The samples were annealed at 425°C for 30 minutes in a vacuum furnace with the heating rate of 10°C /min. The annealed samples were thermal cycled with temperature range (25∼325°C), heating & cooling rate (10 °C/min), dwell time of 2 min at the peak and...
Thermal cycling reliability test and finite element analysis have been conducted for plastic ball grid array assembly with Sn63Pb37 solder. Based on the thermal cycling test results, a two-parameter Weibull distribution model was used to determine the characteristic time to failure of plastic ball grid array assembly. Besides, cross-sectioning and optical microscope examination were utilized to identify...
The effect of electroplating parameters (filling current density and additive concentration) on the copper in Through-Silicon-Via, abbreviated to TSV-Cu, protrusion during annealing is analyzed. Also, the influence of electro deposition parameters, and the annealing process on the TSV-Cu protrusion during thermal cycling are studied. The result shows that, the distribution of the TSV-Cu protrusion...
Three-dimensional (3D) integrated circuit (IC) technology is considered as the preferred More-than-Moore approach due to its capabilities of miniaturization, high density and multi-function. And through silicon via (TSV) is the key enabling technology of 3D integration. So now TSV is getting more and more attention. However, TSV manufacturing processes are still facing several challenges, one of which...
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