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Vibration reliability test for plastic ball grid array solder joints have been developed by performing vibration tests with constant G-level input excitation. A specially designed PBGA assembly with built-in daisy chain circuits was mounted on a printed circuit board as the test vehicle. The test vehicle was mounted on vibration shaker by four standoffs at the corner of the board. It was then excited...
Thermal cycling reliability test and finite element analysis have been conducted for plastic ball grid array assembly with Sn63Pb37 solder. Based on the thermal cycling test results, a two-parameter Weibull distribution model was used to determine the characteristic time to failure of plastic ball grid array assembly. Besides, cross-sectioning and optical microscope examination were utilized to identify...
In the plastic ball grid array package (PBGA) assembly, there are many solder balls and copper pads. The whole packaging varies a lot in size. This multi-scale structure brings difficulties in building the finite element model. The paper refers a method to avoid difficulties by replacing the unconcern copper pad/solder mask layer with a homogenous material layer. The finite element method (FEM) is...
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