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Through silicon vias (TSVs) have been extensively studied because it is a key enabling technology for achieving three dimensional (3D) chip stacking and silicon interposer interconnection. The large mismatch between the coefficients of thermal expansion (CTE) of copper and silicon induces stress which is critical for the TSV reliability performance. This paper proposes analytical solutions of stress...
Interfacial delamination between molding compound (MC) and die pad interface is the most crucial failure mechanism of exposed pad package under reliability testing due to high interfacial stress and weak adhesion strength. A combined interfacial adhesion characterization, JEDEC Moisture Sensitivity Level 3 and 3X IR reflows qualification and testing, finite element analysis as well as finite element...
Warpage, high stress in dies and solder joints are introduced in assembly process of a package-on-package component. In this paper, a finite element approach is proposed to predict the warpages and stresses during the full assembly process. By the techniques of element die and birth as well as restart method, the approach is able to transfer the stress and warpage in one process to the next so that...
The effects of the moment, axial force and shear force induced during drop impact on the peeling stress of the solder joints were investigated by a 2-D beam model and a 3-D solid model of board level electronic package. It shows that the peeling stress is dominated by the bending stress and the maximum occurs at the PCB end. Results of the two models indicated that in the solder joint array only a...
In this paper, the damage fracture of solder joints in board level electronic package subjected to drop impact loadings was numerically simulated by the finite element method and the cohesive zone model. The solder-Cu pad interface was modeled by cohesive zone elements. The results show that fracture initiates at the edge of the PCB side and the damage of solder joint is affected greatly by the used...
In package-on-package (PoP) manufacturing, warpages on both top and bottom packages are concerned. Excess warpage causes solder joint opening, and results in the electrical connection failure of the assembled module. Many parameters of materials, geometry, and process contribute to the warpage of the package. The objective of this paper is to investigate effects of these parameters on the warpage...
The reliability of board level electronic package subjected to drop impact loadings is one of the most concerned issues. In this paper, a standard board level drop impact test was modeled as double cantilever beam model. The deflection and curvature of the Printed Circuit Board (PCB) and the component were compared with that derived from static analysis in order to understand the influence of dynamic...
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