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In this paper, by using the synchrotron radiation real-time imaging, the growth of gas bubbles on solid-liquid interface during the soldering process was investigated. It was proved that the formation and growth of the bubbles was a process of heterogeneous nucleation. During the soldering heating insulation stage, the bubbles volume increased first and remained unchanged afterwards. When there were...
Aniline joins the club: A β‐diketiminato copper(I) catalyst enables CH amination of anilines employing low catalyst loadings to preclude oxidation to the diazene ArNNAr (see scheme). Electron‐poor anilines are particularly resistant towards diazene formation and participate in the amination of strong and unactivated CH bonds. N‐alkyl anilines also take part in CH amination.
Nowadays, with electronic products tending to become shorter, smaller, lighter, and thinner, solder balls used to join chips and substrates are also downsizing. This may have an adverse effect on the reliability of electronic products. The focus of this study is on the effect of solder volume on the interfacial reactions between Sn-3.5Ag, Sn-3.0Ag-0.5Cu lead-free solder balls and electroless nickel...
In this study, the line-type Cu/Sn/Cu and Cu/Sn/Ni interconnects were used to determine the growth kinetics of interfacial intermetallic compounds (IMCs) under electromigration (EM), and the current crowding effect and thermomigration are expected to be avoided in this line-type interconnects because of their symmetric structure. The Cu/Sn/Cu interconnect was under the current density of 5.0×103 A/cm...
The stress relaxation behavior of copper thin films in electro-thermo-mechanical multiple fields has been studied by a developed wafer-curvature method. Experimental results reveal that the electromigration plays an important role in the relaxation process. At tensile stress state, coupled surface diffusion and grain boundary diffusion are the dominant mechanisms even at low temperature. In addition,...
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