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Two-step direct current electroplating was used to fabricate copper microcylinders with a 50 μm diameter and 150 μm depth. The microstructure was characterised by electron back scattering detection. Twin boundaries appeared and the twin quantity depended on the current density. Near the edge (2 mA/cm2), the grain size was large (∼2 μm) and many twins existed, while the size was small (∼0.5 μm) and...
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