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In this paper, three joining methods are employed to join W-Cu alloy and Cu to investigate the effect of joining methods on the resistivity of the joint. The results show that W-Cu alloy is well bonding to the Cu substrate when joining by diffusion vacuum bonding and brazing in vacuum methods. Welding defects is apt to occur when joining by brazing in air. The lowest resistivity of the joint welded...
Using cooper foil as intermediate layer, commercially pure titanium (CP-Ti) was vacuum diffusion welded after surface nanocrystallization. The effects of the interlayer and SNC treatment on the bonding state were discussed thereafter. The results showed that about 10μm nano-structured surface layer was achieved on CP-Ti. Well bonded joint could be obtained by two original CP-Ti samples welded directly...
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