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3D Integration is a promising technology to continue the trend of Moore's law. However, higher density from die stacking introduces thermal challenges that require more expensive packaging and cooling solutions. An alternative integration technology is interposer-based 2.5D design, which has fewer thermal issues but adds extra interposer cost. Designers must be aware of the system-level cost benefits...
Memristor-based neuromorphic computing system provides a promising solution to significantly boost the power efficiency of computing system. Memristor-based neuromorphic computing system has a wide range of design choices, such as the various memristor crossbar cell designs and different parallelism degrees of peripheral circuits. However, a memristor-based neuromorphic computing system simulator,...
Ternary Content-Addressable Memory (TCAM) is widely used in networking routers, fully associative caches, search engines, etc. While the conventional SRAM-based TCAM suffers from the poor scalability, the emerging nonvolatile memories (NVM, i.e., MRAM, PCM, and ReRAM) bring evolution for the TCAM design. It effectively reduces the cell size, and makes significant energy reduction and scalability improvement...
Due to the increasing fabrication and design complexity with new process nodes, the cost per transistor trend originally identified in Moore's Law is slowing when using traditional integration methods. However, emerging die-level integration technologies may be viable alternatives that can scale the number of transistors per integrated device while reducing the cost per transistor through yield improvements...
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