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We describe a novel development of bottom up deposition in the advanced Ionized Physical Vapor Deposition (iPVD) Cu process integrated with iPVD Ti and Chemical Vapor Deposition (CVD) Ru. Combination of CVD Ru and iPVD Cu processes provided us void free Cu filling with enlarging Cu grain size. CVD Ru film had superior wettability to Cu without alloy formation. Cu deposition thickness on field area...
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