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Power and substrate domains are strategically isolated or unified in heterogeneous 3D integration. In-tier probing circuitry provides accessibility to power delivery and substrate networks in a deep tier of a 3D chip stack and capability of diagnosing intra/inter tier coupling. A two-tier demonstrator was successfully tested in a 130 nm CMOS, 3D-SIC Cu TSV technology.
In this paper, we analyze the power supply noise imbalance and its effects on simultaneous switching noise coupling to an ultra high frequency differential low noise amplifier (LNA) in a system-in-package (SiP) through an off-chip power distribution network (PDN). On and off-chip sources of power supply noise imbalance in a LNA in a SiP were analyzed. A simultaneous switching noise coupling coefficient...
In this paper, design, modeling and impact of a partial electromagnetic band-gap (EBG) power distribution network (PDN) using remnants of the signal layer in a multilayer printed circuit board (PCB) are presented. A partial EBG PDN is embodied in a conventional four-layer stack-up PCB without any additional layer, and the impact of the proposed method on signal transmission quality improvement and...
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